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Engineering Technology

Course Descriptions

ETEC 105: Introduction to Electronics

Credits: Maximum of 7.0 possible

An introduction to current, voltage, resistance and power, electronic schematics, components and test equipment. The course includes lectures, demonstrations, and hands-on training. Provides training in basic academic skills.

Course Level Objectives

  1. Take effective lecture notes in a technical class.  [REASON] 
  2. Research a component, concept, or problem on the Internet.  [COMMUNICATE] 
  3. Operate basic electronic test equipment.  [REASON] 
  4. Use a formula to solve for an unknown quantity.  [REASON] 
  5. Build a circuit from a schematic diagram.  [REASON] 
  6. Identify most components on a circuit board.  [COMMUNICATE] 
  7. Use engineering and metric notation in calculations and descriptions of electrical quantities.  [REASON] 
  8. Demonstrate knowledge of electrical quantities.  [COMMUNICATE] 
  9. Write up a lab exercise following a specific format.  [COMMUNICATE] 

ETEC 110: Manufacturing Basics

Credits: Maximum of 7.0 possible

Introduction to basics of manufacturing, including personal protective equipment (PPE), safety practices, and the proper use of equipment to perform basic manufacturing processes such as drilling and cutting on commonly used materials, including metals and composites.

Course Level Objectives

  1. Understand the usage, operation, and benefits of basic PPE equipment.  [REASON] 
  2. Describe standard safety practices for chemicals (MSDS), falls, power tools, electrical, etc. in a manufacturing environment.  [COMMUNICATE] 
  3. List the basic advantages/disadvantages of composites and metals and their proper handling techniques.  [COMMUNICATE] 
  4. Operate drilling and cutting equipment properly.  [ACT] 
  5. Measure process results, such as hole dimensions and fastener torque.  [REASON] 
  6. Develop listening comprehension especially as it relates to lectures and note taking.  [COMMUNICATE] 
  7. Develop oral questioning and listening abilities critical to academic and career success.  [COMMUNICATE] 
  8. Develop writing skills including basic grammar, summarizing, clarity, and accuracy.  [COMMUNICATE] 
  9. Increase vocabulary and vocabulary building skills especially as applied to course work and the manufacturing environment.  [COMMUNICATE] 
  10. Develop and apply study and test taking skills.  [COMMUNICATE] 

ETEC 111: Soldering and Cabling

Credits: 5.0

Basic soldering/desoldering of through-hole components and surface mount components. Covers using tools and microscopes, parts identification and making copper network cable terminations. No prerequisite required.

Course Level Objectives

  1. Produce various types of cable terminations.  [REASON] 
  2. Identify common electronics parts.  [COMMUNICATE] 
  3. Perform conventional through-hole soldering/desoldering of electronic components.  [REASON] 
  4. Perform surface mount soldering/desoldering of electronic components.  [REASON] 
  5. Demonstrate knowledge of the potential hazards in soldering.  [COMMUNICATE] 

ETEC 112: Network Cabling-UTP and Fiber Optic

Credits: 3.0

Making Fiber Optic, UTP and coaxial cable terminations. Includes building codes, installation procedures and basic cable testing.

Course Level Objectives

  1. Test cables and terminations using network test equipment.  [REASON] 
  2. Measure and calculate cable runs.  [REASON] 
  3. Identify unshielded twisted pair and fiber optic cabling parts and components and describe their functions.  [COMMUNICATE] 
  4. Demonstrate knowledge of cable construction and bend radius.  [COMMUNICATE] 
  5. Make UTP and Fiber Optic cable terminations.  [ACT] 

ETEC 115: Introduction to Additive Mfg/Rapid Prototyping

Credits: 3.0

Topics include additive manufacturing fundamentals, terminology, main categories and Rapid Prototyping machine technology types, advantages vs. disadvantages of varied additive manufacturing technologies, basic skills in 3-D software, practical application of 3-D printing. Prerequisite(s): Completion of ENGR&; 114, with a grade of 2.0 or better, or a grade of "S", or industry experience in CAD/CAM, or one year of experience in the Additive Manufacturing industry, or instructor permission.

Course Level Objectives

  1. Compare the differing properties and characteristics of common materials used for additive manufacturing models.  [REASON] 
  2. Develop a part using 3D-CAD software.  [REASON] 
  3. Perform initial part-build setup on a 3D printer.  [REASON] 
  4. Describe the various additive manufacturing processes.  [COMMUNICATE] 
  5. Define the terminology used in additive manufacturing today.  [COMMUNICATE] 
  6. Describe the different hardware systems used in the production of prototypes, with emphasis on the specific additive manufacturing machines used in lab activities for this course.  [COMMUNICATE] 
  7. Identify and discuss three main categories of additive manufacturing processes, including specific additive manufacturing machine types used in each of the three categories.  [COMMUNICATE] 
  8. Describe the procedures for setting up a additive manufacturing process for a part run.  [COMMUNICATE] 
  9. Demonstrate skill in the use of measurement tools, and dimensional analysis of additive manufacturing models.  [ACT] 
  10. Apply learned skills to finish additive manufacturing model projects.  [ACT] 

ETEC 116: Additive Manufacturing/Molding/Casting

Credits: 3.0

Provides the student with knowledge and skills in additive manufacturing technology. Primary topics will include vacuum forming fundamentals, silicon molding, urethane, investment casting, Computer Numerical Control (CNC) operations and post processing of lab created projects. Prerequisite(s): Completion of ETEC 115, with a grade of 2.0 or better or a grade of "S", or instructor permission.

Course Level Objectives

  1. Develop, create and post process parts using all processes taught in this class.  [REASON] 
  2. Describe the various additive manufacturing processes.  [COMMUNICATE] 
  3. Describe the principles of vacuum forming and material requirements.  [COMMUNICATE] 
  4. Describe the principles of silicon molding, urethane molding, investment casting and material requirements.  [COMMUNICATE] 
  5. Perform the process of vacuum forming and material requirements.  [ACT] 
  6. Perform the process of silicon molding, urethane molding, investment casting and material requirements.  [ACT] 
  7. Apply learned skills to create a student/team designed functional part from the design phase to post processing.  [ACT] 

ETEC 117: Additive Manufacturing/Metal Printing

Credits: 3.0

Obtain knowledge and skills in additive manufacturing technology. The focus will be on using the advanced capabilities of 3D modeling software, the operation and theory of metal printing equipment, and the use of scanning equipment in the additive manufacturing industry. Prerequisite(s): Completion of ETEC 115 and ETEC 116 with a grade of 2.0 or better, or a grade of "S", or instructor permission.

Course Level Objectives

  1. Infiltrate a metal printed part using the correct process.  [REASON] 
  2. Demonstrate product testing procedures using created parts.  [COMMUNICATE] 
  3. Describe the principles, process, and operation of 3D metal printing equipment.  [COMMUNICATE] 
  4. Create new part files using scanning equipment.  [ACT] 
  5. Apply learned skills to create a student/team designed functional part from the design phase to post processing.  [ACT] 

ETEC 120: Introduction to Metrology

Credits: Maximum of 7.0 possible

Introduction to basic measurement techniques used in manufacturing and QA environments and the equipment used to perform measurements. Prerequisite(s): Placement in MATH 060, BRDGE 093, or EAP 121.

Course Level Objectives

  1. Describe, select, and use a variety of measurement tools, such as calipers and microscopes.  [REASON] 
  2. Establish calibration intervals using usage history and gage studies.  [REASON] 
  3. Explain various inspection and testing concepts and processes, including Non-Destructive Testing (NDT).  [REASON] 
  4. Explain and apply sampling systems.  [REASON] 

ETEC 125: Aviation Fundamentals

Credits: 2.0

An exploration of the fundamentals of aviation. Principles of flight, aircraft systems, aircraft structures, control surfaces and potential aerospace careers will be covered. Requires the ability to read and communicate in English and the ability to use a computer and the Internet.

Course Level Objectives

  1. State the basic principles of powered flight.  [COMMUNICATE] 
  2. Identify the major components inside and outside of an aircraft.  [COMMUNICATE] 
  3. Identify and explain the resulting motion for each of the aircraft's control surfaces.  [REASON] 
  4. List various aerospace careers.  [COMMUNICATE] 

ETEC 126: AET Certification Test Prep

Credits: 1.0

Review of the National Center for Aerospace and Transportation Technologies (NCATT) Aircraft Electronics Technician (AET) standards and preparation for the certification exam. Prerequisite(s): ETEC 111, ETEC 125, ETEC 161, ETEC 162, ETEC 163 or instructor's permission.

Course Level Objectives

  1. Correctly answer 80 percent of the sample AET test questions in preparation for taking the AET Certification Exam.  [REASON] 

ETEC 130: Quality Assurance Tools

Credits: Maximum of 7.0 possible

Introduction to quality assurance tools and concepts used in manufacturing and how to effectively apply and use them. Prerequisite(s): Placement into MATH 060, BRDGE 093 or EAP 121.

Course Level Objectives

  1. Calculate and apply simple control charts and describe their meaning.  [REASON] 
  2. Select, construct, and apply the seven quality tools: cause and effect diagrams, flow charts, check sheets, Parato diagrams, scatter diagrams, control charts, and histograms.  [ACT] 
  3. Explain quality concepts, such as Six Sigma, cost of quality, ISO certification and continuous improvement techniques.  [COMMUNICATE] 
  4. Describe the basic principles of audits and CAPA systems.  [COMMUNICATE] 
  5. Explain and apply basic statistical techniques such as, mean and standard deviation.  [COMMUNICATE] 

ETEC 150: Applied Technical Math

Credits: 5.0

Using algebra and trigonometry to solve problems in electronics and manufacturing. Also covers use of scientific calculator, binary and hexadecimal. Prerequisite(s): High school algebra or equivalent or instructor permission.

Course Level Objectives

  1. Convert numbers to and from decimal, scientific, engineering and metric notation.  [REASON] 
  2. Use simple algebraic formulas to solve for an unknown quantity.  [REASON] 
  3. Calculate for various electrical quantities in a circuit.  [REASON] 
  4. Solve simple equations involving right angle trigonometry.  [REASON] 

ETEC 155: Special Topics

Credits: Maximum of 5.0 possible

Topics of current interest in robotics, electronics, and manufacturing.

Course Level Objectives

  1. Demonstrate knowledge of a particular area of robotics, electronics or networks.  [COMMUNICATE] 

ETEC 159: Introduction to Composites and Materials

Credits: 1.0

Introduction to a variety of common materials used in fiber/matrix composites, their safety considerations and general properties which can be achieved with different manufacturing and orientation procedures.

Course Level Objectives

  1. Identify why composites are increasingly preferred over metals in industry applications.  [REASON] 
  2. Identify and describe how composites are used in the aerospace and other industries.  [COMMUNICATE] 
  3. Identify differences in working with composite structures versus metallic structures.  [REASON] 
  4. Define terms specific to the composites industry.  [COMMUNICATE] 
  5. Recognize the importance of following EPA and OSHA regulations.  [REASON] 
  6. Identify the health hazards of working with composite materials.  [COMMUNICATE] 
  7. Demonstrate and assess safety considerations when working with composite materials.  [REASON] 
  8. Identify the most common types of materials and their processing, properties, applications, proper storage and handling and environmental effects (fiberglass, Kevlar, carbon, fiber, epoxy, polyester and other materials in fiber matrix composites).  [REASON] 
  9. Define and identify the importance of the interface in composites.  [REASON] 
  10. Identify the importance of surface preparation in composites.  [REASON] 

ETEC 161: DC Electronics

Credits: 5.0

Basics of DC circuits covers components used in DC circuits i.e., resistors, capacitors, diodes; introduction to digital. Building, testing, and troubleshooting with basic test equipment; basic circuit analysis using component theory and algebra. Prerequisite(s): High school algebra or instructor permission.

Course Level Objectives

  1. Identify a variety of electronic components and state their rated values.  [REASON] 
  2. Construct and test DC circuits using a power supply and test equipment.  [REASON] 
  3. Analyze DC resistive circuits using basic math and Ohm's.  [REASON] 
  4. Troubleshoot a DC circuit to isolate a short or open in the circuit with standard test equipment.  [REASON] 
  5. Analyze, test, and troubleshoot RC circuits with a DC pulse voltage source.  [REASON] 
  6. Perform functional tests and troubleshoot a small digital system.  [REASON] 

ETEC 162: AC and Linear Electronics

Credits: 5.0

Basics of AC and linear circuits. Includes components covered in DC quarter, RC circuits, inductors, filters, diodes, power supplies, transistors, and operational amplifiers. Testing and troubleshooting circuits where voltage changes over time. Practice using DMM and oscilloscope. Prerequisite(s): ETEC 161 or instructor permission.

Course Level Objectives

  1. Analyze, test, and troubleshoot an RC circuit.  [REASON] 
  2. Construct, analyze and test a variety of passive filter circuits.  [REASON] 
  3. Analyze, test, and troubleshoot AC resistive circuits.  [REASON] 
  4. Analyze, test, and troubleshoot transistor circuits with a split power supply.  [REASON] 
  5. Explain the difference between direct current and alternating current.  [COMMUNICATE] 
  6. Describe the effect of frequency on an RC circuit.  [COMMUNICATE] 
  7. Use a function generator to create AC waveforms and an oscilloscope to display them.  [ACT] 

ETEC 163: Digital and Microprocessor Electronics

Credits: 5.0

Introduction to digital and microprocessor circuits. Covers operation of basic logic gates, flip-flops, decoders, multiplexers, counters, and microprocessor circuits. Lectures and hands on exercises to learn how to analyze, test, and troubleshoot digital and microprocessor circuits.

Course Level Objectives

  1. Identify basic logic gates and construct their truth tables.  [REASON] 
  2. Analyze and predict the operation of complex digital circuits.  [REASON] 
  3. Identify on a schematic, and describe the function of, the basic blocks of a microprocessor system.  [REASON] 
  4. Demonstrate the proper use of electrostatic discharge protective equipment related to integrated circuits.  [ACT] 
  5. Write and execute simple looping programs on a microprocessor system.  [COMMUNICATE] 
  6. Observe and test basic data flow and control line function using a microprocessor system tester for READ and WRITE operations.  [EXPLORE] 
  7. Use an oscilloscope to display and identify basic microprocessor system operation by displaying data and address bits and control lines.  [ACT] 

ETEC 169: Fiber Reinforced Composites: Manufacturing

Credits: 2.0

Explores a variety of methods used to fabricate and manufacture fiber reinforced composites. Also addresses the advantages and disadvantages of different processes, safety and tooling considerations. Prerequisite(s): ETEC 159.

Course Level Objectives

  1. Describe a variety of methods to fabricate and manufacture fiber reinforced composites, the advantages and disadvantages of each, the process variables for each and the different materials used for each of the following methods: a. Autoclave processing (ply cutting to hand lay-up to vacuum bagging to curing in autoclave); b. Liquid composite molding (infusion molding including RTM and VARTM); c. Filament Winding; d. Tape Lay-up; e. Compression Molding; f. Pultrusion.  [COMMUNICATE] 
  2. Describe the need for and process of co-curing and co-bonding.  [REASON] 
  3. Drill, trim and finish composite parts to specification.  [ACT] 
  4. Weigh, measure, mix and prepare chemicals and specimens per specifications.  [ACT] 
  5. Identify proper tools to use in composite manufacturing.  [REASON] 
  6. Use lay-up and support tooling.  [ACT] 
  7. Describe primary issues to be considered when fabricating a mold.  [COMMUNICATE] 
  8. Assemble parts to specifications.  [ACT] 
  9. Define/develop specifications, procedures and objectives from blueprints/drawings.  [REASON] 
  10. Describe the following safe practices: a. Logging tools (ingress/egress) and explain when it is necessary to tether tools; b. Using appropriate lifting techniques; c. Describing catch nets, scaffolding, and staging; d. Setting up and maintain safe work area; e. Describing buddy system and lock out/tag out procedures; f. Monitoring breathing zones and wind direction; g. Following clean room and controlled environment procedures.  [COMMUNICATE] 

ETEC 175: Introduction to Materials Science

Credits: 5.0

Mechanical, chemical and thermal properties of engineering materials including metals, alloys, ceramics, polymers and composites. Includes materials microstructure, atomic bonding, atomic arrangement, crystal structure, coexisting phases, interfaces, defects and impurities. Prerequisite(s): ENGL 100 with a grade of at least 2.0, Placement into MATH 090.

Course Level Objectives

  1. Explain the differences in properties of different materials, including metals, alloys, ceramics, polymers and composites.  [COMMUNICATE] 
  2. Relate the properties of materials to microstructure.  [REASON] 
  3. Describe the basics of processing techniques for altering the microstructure and properties of different materials.  [COMMUNICATE] 
  4. Apply the basic principles of material selection to specific applications.  [REASON] 

ETEC 176: Introduction to Robotics

Credits: 5.0

Introduction to microcontrollers, robotics, and automation through hands on training using a small scale robot. Students will build, test, program, and troubleshoot their robots. Utilizes electronic principles and test equipment. Prerequisite(s): Concurrent enrollment in ETEC 161, or ETEC 251, or ETEC 210, or instructor permission.

Course Level Objectives

  1. Identify all parts and components and describe their function in the robotic system.  [COMMUNICATE] 
  2. Test wires, resistors and LEDs using a multimeter.  [REASON] 
  3. Write a short functional test program on a computer and download it to a robot.  [REASON] 
  4. Write well documented programs to read sensors and control outputs.  [COMMUNICATE] 
  5. Run functional test programs and evaluate the actions of the robot.  [REASON] 

ETEC 177: Robotics 2

Credits: 5.0

Through the use of projects and hands on exercises, students will learn to program a small scale robot to perform basic navigation under program control, with various sensor inputs, using feedback and control techniques. Prerequisite(s): Concurrent enrollment in ETEC 162 or ETEC 252 or instructor permission.

Course Level Objectives

  1. Program a microcontroller.  [REASON] 
  2. Describe the operation of a servo motor.  [COMMUNICATE] 
  3. Demonstrate the use of different types of basic sensors.  [COMMUNICATE] 
  4. Troubleshoot the software and hardware of a small robotic system.  [REASON] 
  5. Program simple artificial intelligence into a robotic system.  [REASON] 
  6. Write and execute a variety of programs for robotic navigation.  [REASON] 
  7. Implement the use of a new microcontroller platform into an existing robot system.  [REASON] 

ETEC 178: Robotics 3

Credits: 5.0

Through the use of functional testing and the oscilloscope, students will learn to troubleshoot a robotic system. Also introduces the student to programming a large scale robot using LabVIEW and programming and building a robot system using the Arduino prototyping platform. Prerequisite(s): ETEC 177 and ETEC 162 with a minimum grade of 2.0 or instructor permission.

Course Level Objectives

  1. Write complex programs that control a microcontroller based robot.  [REASON] 
  2. Troubleshoot the hardware and software of a microcontroller system using functional testing and the oscilloscope.  [REASON] 
  3. Program a microcontroller based control system using a compiler.  [REASON] 
  4. Implement the use of a new platform using the old microcontroller robot system.  [REASON] 
  5. Work as a team to accomplish a complex task with the microcontroller and robot.  [ACT] 

ETEC 180: Polymer Technology

Credits: 5.0

Course provides an overview of thermoset and thermoplastic polymers. Topics include chemical composition, physical properties, deformation, mechanical behavior, fabrication, processing and manufacturing of polymers. Prerequisite(s): ENGL 100 with a grade of at least 2.0. Placement into MATH 090.

Course Level Objectives

  1. Describe the basic properties and characteristics of polymers.  [COMMUNICATE] 
  2. Explain and apply the basics of deformation, elasticity, and mechanical behavior in polymeric materials.  [REASON] 
  3. Explain the relationship between polymer structure and properties.  [REASON] 
  4. Identify the different types of polymers, including elastomers and fibers.  [COMMUNICATE] 
  5. Explain the various fabrication techniques of polymeric materials, and explain the advantages and disadvantages.  [COMMUNICATE] 
  6. Apply and explain the application of polymers to engineering and composite manufacturing.  [REASON] 
  7. Perform basic qualification and selection of polymer materials.  [REASON] 

ETEC 189: Fiber Reinforced Composites: Repair

Credits: 1.5

Students will gain an understanding of inspection, documentation and composite repair. The techniques covered will include surface, potted, taper sanded, and bolted methods. Prerequisite(s): ETEC 169.

Course Level Objectives

  1. Perform quality inspection.  [REASON] 
  2. Document the part condition before repair.  [COMMUNICATE] 
  3. Identify sources of composite damage.  [REASON] 
  4. Describe different repair techniques for different sorts of composite damage.  [COMMUNICATE] 
  5. Define foreign object damage (FOD) and identify sources of FOD.  [COMMUNICATE] 
  6. Conduct basic repairs.  [ACT] 

ETEC 190: Awareness of Critical Composite Maintenance and Repair Issues

Credits: 3.0

Provides an overview of composites repair technology and procedures in commercial aerospace. Applicable to engineers, technicians, inspectors who interface with composite materials technology. Prerequisite(s): ETEC 250 with a grade of 2.0 or higher or instructor permission.

Course Level Objectives

  1. Distinguish between skills needed for structures engineers, inspectors and technicians dealing with composite maintenance and repair, including identifying the steps required in repair design, process planning, inspection, and approval.  [REASON] 
  2. Identify composite damage types and sources and their significance to structural integrity.  [REASON] 
  3. Identify and describe information contained in source and regulatory documentation.  [COMMUNICATE] 
  4. Describe composite laminate fabrication and bonded repair methods, including typical processing defects that occur in composite laminate fabrication and bonded repair.  [COMMUNICATE] 
  5. Describe composite laminate bolted assembly and repair methods.  [COMMUNICATE] 
  6. Describe latest developments in research on maintenance and repair of composite materials.  [COMMUNICATE] 

ETEC 191: Awareness of Critical Composites and Maintenance and Repair Issues: Lab

Credits: 1.0

Apply principles learned in ETEC 190 in a handson laboratory setting. Emphasis is on bonded composite repair practice, pre- and post-repair inspection, and the use of approved documentation in repair design to satisfy regulatory requirement. Prerequisite(s): ETEC 190 with a grade of 2.0 or higher or concurrent enrollment in ETEC 190 or instructor permission.

Course Level Objectives

  1. Using supplied materials, identify composite damage types and sources and their significance to structural integrity.  [REASON] 
  2. Demonstrate the use of composite laminate fabrication and bonded repair methods, including typical processing defects that occur in both methods.  [REASON] 
  3. Perform a bonded composite repair.  [REASON] 
  4. Using supplied materials, demonstrate composite damage and repair inspection procedures.  [REASON] 
  5. Describe composite laminate bolted assembly and repair methods, and perform and inspect a bolted composite repair.  [COMMUNICATE] 
  6. Write an appropriate repair procedure and in-process quality control plan based on a chosen repair option.  [COMMUNICATE] 

ETEC 199: Special Projects

Credits: 1.0 to 5.0

For projects in robotics, electronics, and manufacturing. Credit available with approval. For information contact the program manager at 425.640.1902.

Course Level Objectives

  1. Produce a circuit, project, paper or presentation on a department approved topic.  [ACT] 
  2. Research the topic on the Internet.  [COMMUNICATE] 
  3. Track their use of time in creating this project.  [REASON] 

ETEC 200: Introduction to Composites

Credits: 5.0

General overview of composite materials and fabrication procedures. Covers composite constituents, material forms, mold design and development, ASTM standards, fabrication processes, composite applications, bonding, fastening, laminating, and finishing techniques. Prerequisite(s): ENGL 100 with a grade of at least 2.0. Placement into MATH 090.

Course Level Objectives

  1. Explain the basic properties, characteristics and constituents of composite materials.  [COMMUNICATE] 
  2. Explain the functions and elements of ASTM standards.  [COMMUNICATE] 
  3. Explain and apply the different fabrication processes for composite materials, including bonding, fastening, laminating, and finishing techniques.  [REASON] 
  4. Describe the primary usage of composite materials in today's industry and potential for future applications.  [REASON] 
  5. Perform basic fabrication processes in making composite structures.  [ACT] 
  6. Follow procedures when using lab equipment, and apply safety procedures when working in the lab.  [ACT] 

ETEC 210: Electronics for A+

Credits: 5.0

Intensive survey of electronics for students in computer or industrial technologies. Covers electrical concepts, electronic components, schematics and test equipment. Extensive hands on training.

Course Level Objectives

  1. Demonstrate knowledge of electrical quantities.  [COMMUNICATE] 
  2. Operate basic electronic test equipment.  [ACT] 
  3. Use engineering notation and metric notation in calculations and descriptions of electrical and computer quantities.  [REASON] 
  4. Identify most components on a circuit board.  [REASON] 
  5. Research a component, concept, or problem on the Internet.  [REASON] 
  6. Troubleshoot an open in a simple circuit or device.  [REASON] 
  7. Build a circuit from a schematic diagram.  [REASON] 
  8. Analyze and test a circuit for proper operation.  [REASON] 

ETEC 211: Lean Manufacturing

Credits: 5.0

Introduction to lean manufacturing using the Six Sigma process improvement structure. Manage the value stream of processes with techniques such as identifying waste, transition to pull, use of kanbans, 5S, and supply chain management. Prerequisite(s): ENGL& 101 and MATH 090, each with a grade of 2.0 or higher.

Course Level Objectives

  1. Describe basic continuous improvement processes including lean, Six Sigma, and total quality management.  [COMMUNICATE] 
  2. Map and analyze a value stream.  [REASON] 
  3. Describe the eight types of waste that exist in manufacturing and transactional processes.  [COMMUNICATE] 
  4. Explain the difference between push and pull manufacturing.  [REASON] 
  5. Calculate process cycle time, process cycle efficiency, critical work in process, and inventory turns.  [REASON] 
  6. Set up a replenishment pull system.  [ACT] 
  7. Describe key features of a supply chain management program and stocking strategy.  [COMMUNICATE] 
  8. Identify process constraints.  [COMMUNICATE] 
  9. Implement quick changeover techniques.  [ACT] 
  10. Demonstrate the ability to work in teams.  [ACT] 

ETEC 215: Applied Statics

Credits: 5.0

Study of forces acting on structures at rest: free body diagrams (FBDs), trusses, friction and related material, which may include hydrostatic pressures and loads, cables and arches. Prerequisite(s): Placement into MATH 090.

Course Level Objectives

  1. Explain and apply the principles of vector mechanics, vector algebra, and of representation of physical quantities by a vector notation.  [REASON] 
  2. Explain the physical meaning of a force and a moment equilibrium. Draw a correct and complete FBD of forces and moments for a structure.  [COMMUNICATE] 
  3. Explain and apply the method of joints and the method of sections for the analysis of trusses.  [REASON] 
  4. Explain and apply the concept of friction on surfaces, calculate friction forces, and draw the proper FBD showing friction forces.  [REASON] 
  5. Explain the difference between static and dynamic friction. Explain and apply the principles of internal forces in structures, and draw shear and moment diagrams for beams.  [COMMUNICATE] 

ETEC 220: Applied Strengths of Materials

Credits: 5.0

Study of forces acting on structures at rest; free body diagrams (FBDs), trusses, friction. Analysis of tension, compression, shear, deformation, and stress acting on members. Prerequisite(s): ETEC 215 with a grade of at least 2.0.

Course Level Objectives

  1. Explain and apply the principles of vector mechanics, vector algebra, and of representation of physical quantities by a vector notation.  [REASON] 
  2. Explain the physical meaning of a force and a moment equilibrium.  [COMMUNICATE] 
  3. Draw a correct and complete FBD of forces and moments for a structure.  [COMMUNICATE] 
  4. Select and apply tools to analyze tension, compression, shear, deformation, torsion, and stress of members.  [REASON] 
  5. Apply the basics of materials testing procedures to measure mechanical properties.  [REASON] 
  6. Correctly use computerized materials test instrumentation and interpret test results.  [REASON] 
  7. Run tensile, compressive, flexural, peel tests, and interpret test curves.  [ACT] 

ETEC 250: Composites Engineering Design

Credits: 5.0

Overview of structural design utilizing composite materials including material and process selection, structural design, aesthetic qualities, assembly, and practical design information. This is a lab based course focusing on product design. Prerequisite(s): ETEC 200 or concurrent enrollment.

Course Level Objectives

  1. Apply the basic principles of structural design utilizing composite material.  [REASON] 
  2. Explain the advantages of planning a design to meet the manufacturing requirements.  [COMMUNICATE] 
  3. Apply the basic principles of material and process selection, structural design, aesthetic design, and assembly.  [REASON] 
  4. Perform design, construction, and fabrication of laminated parts.  [ACT] 
  5. Use appropriate terminology as it relates to composite structure design and manufacturing.  [COMMUNICATE] 
  6. Perform simple repairs of composite structures.  [ACT] 
  7. Follow appropriate processes for structural and nonstructural evaluation, material handling, surface preparation.  [REASON] 

ETEC 251: Advanced Digital Circuits

Credits: 5.0

Advanced training in digital electronics. Covers analyzing, functional testing, and systematic troubleshooting of digital circuits designed with logic dates, flip-flops, one shots, counters, dividers, decoders, shift registers, memory circuits, latches, and buffers. Prerequisite(s): ETEC 163 or training in basic digital circuits or instructor permission.

Course Level Objectives

  1. Analyze and predict actual circuit operation of different types of digital circuits, using the thinking tools of basic electronics.  [REASON] 
  2. Design functional tests for different types of digital circuits.  [REASON] 
  3. Perform a functional test, interpret results, choose a circuit stimulus, and make systematic measurements, to isolate a fault.  [REASON] 
  4. Document one's testing and troubleshooting process by recording information on a form and schematic.  [COMMUNICATE] 

ETEC 252: Advanced Robotics

Credits: 5.0

Advanced training in robotics systems. Includes programming a microcontroller in a C-type language to read sensors and control outputs, and troubleshooting software and hardware using functional testing. A robotics system project is required. Prerequisite(s): ETEC 163 and 251 or training in digital and basic microprocessor systems.

Course Level Objectives

  1. Write well documented code to control a robot.  [COMMUNICATE] 
  2. Interpret programs to describe the operation of a robot.  [REASON] 
  3. Identify parts and components and describe their function in the system.  [REASON] 
  4. Write functional test programs for a robotic system.  [REASON] 
  5. Troubleshoot a complex system and document the process.  [REASON] 
  6. Read microcontroller data sheets to access registers in the microcontroller.  [REASON] 
  7. Add new sensors and output devices to the robot and reprogram the microcontroller accordingly.  [REASON] 

ETEC 253: Advanced Linear Circuits

Credits: 5.0

Analyzing and systematic testing of linear circuits designed with operational amplifiers as comparators, buffers, amplifiers, filters, regulators, drivers, integrators, and instrumentation amplifiers. D/A, A/D converters, timers, and transistor circuits included. Prerequisite(s): ETEC 162 or instructor permission.

Course Level Objectives

  1. Analyze and predict actual circuit operation of different types of linear circuits, using the thinking tools of basic electronics.  [REASON] 
  2. Design functional tests for different types of linear circuits.  [REASON] 
  3. Using one's functional tests and hands-on circuit experience, be able to test, interpret tests, choose a circuit stimulus, and make systematic measurements, to isolate a fault.  [REASON] 
  4. Document one's testing and troubleshooting process by recording information on a form and schematic.  [COMMUNICATE] 

ETEC 255: Special Topics

Credits: Maximum of 5.0 possible

Topics of current interest in robotics, electronics, and manufacturing.

Course Level Objectives

  1. Demonstrate knowledge of a special topic in robotics, electronics or networks.  [COMMUNICATE] 

ETEC 260: Composites Manufacturing

Credits: 5.0

Overview of processes involved in development and production of composite products. Includes tooling, fabrication, machining, assembly, quality assurance, repair, lay-up, vacuum bagging, and cureprocessing of wet laminating techniques and pre-impregnated materials. Prerequisite(s): ETEC 250 with a grade of at least 2.0.

Course Level Objectives

  1. Apply the basic principles of structural design utilizing composite materials.  [REASON] 
  2. Explain the advantages of planning a design to meet the manufacturing requirements.  [COMMUNICATE] 
  3. Apply the basic principles of materials and process selection, structural design, aesthetic design, and assembly.  [REASON] 
  4. Perform design, construction, and fabrication of laminated parts.  [ACT] 
  5. Use appropriate terminology as it relates to composite structure design and manufacturing.  [COMMUNICATE] 
  6. Perform simple repairs of composite structures.  [ACT] 
  7. Follow appropriate processes for structural and nonstructural evaluation, material handling, and surface preparation.  [REASON] 

ETEC 291: ETEC Internship

Credits: 1.0 to 10.0

Students working toward the ETEC degree, who are in the second year of their coursework, receive on-the-job training in materials science. One credit for each 30 hours worked. Prerequisite(s): Instructor signature is required for registration.

Course Level Objectives

  1. Document their work hours at the internship site and produce a supervisor's evaluation of their work.  [COMMUNICATE] 
  2. Demonstrate skills necessary for the workplace at which the internship takes place.  [REASON] 

ETEC 292: Career Planning

Credits: 2.0

Designed to give students an overview of engineering technology careers. Includes field trips, resume building, interviewing skills, and job searching skills. Prerequisite(s): Placement in ENGL& 101.

Course Level Objectives

  1. Search for information on specific careers.  [EXPLORE] 
  2. Obtain company information and assess best fit with personal professional interests and goals.  [ACT] 
  3. Write and format an effective resume.  [COMMUNICATE] 
  4. Access local and regional resources to support job searching.  [EXPLORE] 

ETEC 299: Special Projects

Credits: 1.0 to 5.0

For individual projects in electronics, robotics, and manufacturing. Credit available with approval. For information contact the program manager 425.640.1902.

Course Level Objectives

  1. Produce a circuit, project, paper or presentation on a department approved topic of the student's choice.  [ACT] 
  2. Research the topic on the Internet.  [COMMUNICATE] 
  3. Track their use of time in creating the project.  [REASON]