Engineering Technology

Course Descriptions

ETEC 105: Introduction to Electronics

Credits: 5.0

An introduction to current, voltage, resistance and power, electronic schematics, components, and test equipment. The course includes lectures, demonstrations, and hands-on training. Provides training in basic academic skills. Prerequisite(s): EAP 100 or BRDGE 090 and placement into MATH 077.

Course Level Objectives

  1. Take effective lecture notes in a technical class.
  2. Research a component, concept, or problem on the Internet.
  3. Operate basic electronic test equipment.
  4. Use a formula to solve for an unknown quantity.
  5. Build a circuit from a schematic diagram.
  6. Identify most components on a circuit board.
  7. Use engineering and metric notation in calculations and descriptions of electrical quantities.
  8. Demonstrate knowledge of electrical quantities.
  9. Write up a lab exercise following a specific format.

ETEC 110: Manufacturing Basics

Credits: 5.0

Introduction to basics of manufacturing, including personal protective equipment (PPE), safety practices, and the proper use of equipment to perform basic manufacturing processes such as drilling and cutting on commonly used materials, including metals and composites. Prerequisite(s): BRDGE 090 or EAP 100 and placement in MATH 077.

Course Level Objectives

  1. Understand the usage, operation, and benefits of basic PPE equipment.
  2. Describe standard safety practices for chemicals (MSDS), falls, power tools, electrical, etc. in a manufacturing environment.
  3. List the basic advantages/disadvantages of composites and metals and their proper handling techniques.
  4. Operate drilling and cutting equipment properly.
  5. Measure process results, such as hole dimensions and fastener torque.
  6. Develop listening comprehension especially as it relates to lectures and note taking.
  7. Develop oral questioning and listening abilities critical to academic and career success.
  8. Develop writing skills including basic grammar, summarizing, clarity, and accuracy.
  9. Increase vocabulary and vocabulary building skills especially as applied to course work and the manufacturing environment.
  10. Develop and apply study and test taking skills.

ETEC 111: Soldering and Inspection

Credits: 5.0

Basic soldering and desoldering of through-hole components and surface mount components. Covers using tools and microscopes, parts identification, and inspection. Prepares students for IPC certification. Prerequisite(s): EAP 100 or BRDGE 093 and placement into MATH 077.

Course Level Objectives

  1. Identify common electronics parts.
  2. Perform conventional through-hole soldering and desoldering of electronic components.
  3. Perform surface mount soldering and desoldering of electronic components.
  4. Demonstrate knowledge of the potential hazards in soldering.

ETEC 115: Introduction to Additive Manufacturing and Rapid Prototyping

Credits: 3.0

Topics include additive manufacturing fundamentals, terminology, main categories and Rapid Prototyping machine technology types, advantages vs. disadvantages of varied additive manufacturing technologies, basic skills in 3-D software, practical application of 3-D printing. S/U grade option. Prerequisite(s): ENGR& 114 or instructor permission.

Course Level Objectives

  1. Compare the differing properties and characteristics of common materials used for additive manufacturing models.
  2. Develop a part using 3D-CAD software.
  3. Perform initial part-build setup on a 3D printer.
  4. Describe the various additive manufacturing processes.
  5. Define the terminology used in additive manufacturing today.
  6. Describe the different hardware systems used in the production of prototypes, with emphasis on the specific additive manufacturing machines used in lab activities for this course.
  7. Identify and discuss three main categories of additive manufacturing processes, including specific additive manufacturing machine types used in each of the three categories.
  8. Describe the procedures for setting up a additive manufacturing process for a part run.
  9. Demonstrate skill in the use of measurement tools, and dimensional analysis of additive manufacturing models.
  10. Apply learned skills to finish additive manufacturing model projects.

ETEC 116: Additive Manufacturing, Molding, and Casting

Credits: 3.0

Provides the student with knowledge and skills in additive manufacturing technology. Primary topics will include vacuum forming fundamentals, silicon molding, urethane, investment casting, Computer Numerical Control (CNC) operations and post processing of lab created projects. S/U grade option. Prerequisite(s): ETEC 115 or instructor permission.

Course Level Objectives

  1. Develop, create and post process parts using all processes taught in this class.
  2. Describe the various additive manufacturing processes.
  3. Describe the principles of vacuum forming and material requirements.
  4. Describe the principles of silicon molding, urethane molding, investment casting and material requirements.
  5. Perform the process of vacuum forming and material requirements.
  6. Perform the process of silicon molding, urethane molding, investment casting and material requirements.
  7. Apply learned skills to create a student/team designed functional part from the design phase to post processing.

ETEC 117: Additive Manufacturing and Metal Printing

Credits: 3.0

Obtain knowledge and skills in additive manufacturing technology. The focus will be on using the advanced capabilities of 3D modeling software, the operation and theory of metal printing equipment, and the use of scanning equipment in the additive manufacturing industry. S/U grade option. Prerequisite(s): ETEC 116 or instructor permission.

Course Level Objectives

  1. Infiltrate a metal printed part using the correct process.
  2. Demonstrate product testing procedures using created parts.
  3. Describe the principles, process, and operation of 3D metal printing equipment.
  4. Create new part files using scanning equipment.
  5. Apply learned skills to create a student/team designed functional part from the design phase to post processing.

ETEC 120: Introduction to Metrology

Credits: 5.0

Introduction to basic measurement techniques used in manufacturing and QA environments and the equipment used to perform measurements. Prerequisite(s): EAP 100 or BRDGE 093 and placement into MATH 077.​

Course Level Objectives

  1. Describe, select, and use a variety of measurement tools, such as calipers and microscopes.
  2. Establish calibration intervals using usage history and gage studies.
  3. Explain various inspection and testing concepts and processes, including Non-Destructive Testing (NDT).
  4. Explain and apply sampling systems.

ETEC 125: Aviation Fundamentals

Credits: 2.0

An exploration of the fundamentals of aviation. Principles of flight, aircraft systems, aircraft structures, control surfaces and potential aerospace careers will be covered. Requires the ability to read and communicate in English and the ability to use a computer and the Internet. Prerequisite(s): Requires the ability to read and communicate in English and the ability to use a computer and the Internet.

Course Level Objectives

  1. State the basic principles of powered flight.
  2. Identify the major components inside and outside of an aircraft.
  3. Identify and explain the resulting motion for each of the aircraft's control surfaces.
  4. List various aerospace careers.

ETEC 126: AET Certification Test Prep

Credits: 1.0

Review of the National Center for Aerospace and Transportation Technologies (NCATT) Aircraft Electronics Technician (AET) standards and preparation for the certification exam. Prerequisite(s): (ETEC 111, ETEC 125, ETEC 161, ETEC 162, and ETEC 163) or instructor permission.

Course Level Objectives

  1. Correctly answer 80 percent of the sample AET test questions in preparation for taking the AET Certification Exam.

ETEC 130: Quality Assurance Tools

Credits: 5.0

Introduction to quality assurance tools and concepts used in manufacturing and how to effectively apply and use them. Prerequisite(s): EAP 100 or BRDGE 093 and placement into MATH 087.

Course Level Objectives

  1. Calculate and apply simple control charts and describe their meaning.
  2. Select, construct, and apply the seven quality tools: cause and effect diagrams, flowcharts, check sheets, Parato diagrams, scatter diagrams, control charts, and histograms.
  3. Explain quality concepts, such as Six Sigma, cost of quality, ISO certification, and continuous improvement techniques.
  4. Describe the basic principles of audits and CAPA systems.
  5. Explain and apply basic statistical techniques such as mean and standard deviation.

ETEC 150: Applied Technical Math

Credits: 5.0

Using algebra and trigonometry to solve problems in electronics and manufacturing. Also covers use of scientific calculator, binary, and hexadecimal. Prerequisite(s): Placement into MATH 087 or instructor permission

Course Level Objectives

  1. Convert numbers to and from decimal, scientific, engineering, and metric notation.
  2. Use simple algebraic formulas to solve for an unknown quantity.
  3. Calculate for various electrical quantities in a circuit.
  4. Solve simple equations involving right angle trigonometry.

ETEC 155: Special Topics: Engineering Technology

Credits: Maximum of 5.0 possible

Topics of current interest in Engineering Technology.

Course Level Objectives

  1. Demonstrate knowledge of a particular area of engineering technology.

ETEC 161: DC Electronics

Credits: 6.0

Basics of DC circuits covers components used in DC circuits i.e., resistors, capacitors, diodes and introduction to digital. Building, testing, and troubleshooting with basic test equipment; basic circuit analysis using component theory and algebra. Prerequisite(s): Placement into MATH 087 or instructor permission.

Course Level Objectives

  1. Identify a variety of electronic components and state their rated values.
  2. Construct and test DC circuits using a power supply and test equipment.
  3. Analyze DC resistive circuits using basic math and Ohm's.
  4. Troubleshoot a DC circuit to isolate a short or open in the circuit with standard test equipment.
  5. Analyze, test, and troubleshoot RC circuits with a DC pulse voltage source.
  6. Perform functional tests and troubleshoot a small digital system.

ETEC 162: AC and Linear Electronics

Credits: 6.0

Basics of AC and linear circuits. Includes components covered in DC quarter, RC circuits, inductors, filters, diodes, power supplies, transistors and operational amplifiers. Testing and troubleshooting circuits where voltage changes over time. Practice using DMM and oscilloscope. Prerequisite(s): ETEC 161 or instructor permission.

Course Level Objectives

  1. Analyze, test, and troubleshoot an RC circuit.
  2. Construct, analyze, and test a variety of passive filter circuits.
  3. Analyze, test, and troubleshoot AC resistive circuits.
  4. Analyze, test, and troubleshoot transistor circuits with a split power supply.
  5. Explain the difference between direct current and alternating current.
  6. Describe the effect of frequency on an RC circuit.
  7. Use a function generator to create AC waveforms and an oscilloscope to display them.

ETEC 163: Digital and Microprocessor Electronics

Credits: 6.0

Introduction to digital and microprocessor circuits. Covers operation of basic logic gates, flip-flops, decoders, multiplexers, counters and microprocessor circuits. Lectures and hands on exercises to learn how to analyze, test and troubleshoot digital and microprocessor circuits.

Course Level Objectives

  1. Identify basic logic gates and construct their truth tables.
  2. Analyze and predict the operation of complex digital circuits.
  3. Identify on a schematic, and describe the function of, the basic blocks of a microprocessor system.
  4. Demonstrate the proper use of electrostatic discharge protective equipment related to integrated circuits.
  5. Write and execute simple looping programs on a microprocessor system.
  6. Observe and test basic data flow and control line function using a microprocessor system tester for READ and WRITE operations.
  7. Use an oscilloscope to display and identify basic microprocessor system operation by displaying data and address bits and control lines.

ETEC 175: Introduction to Materials Science

Credits: 5.0

Mechanical, chemical, and thermal properties of engineering materials including metals, alloys, ceramics, polymers, and composites. Includes materials microstructure, atomic bonding, atomic arrangement, crystal structure, coexisting phases, interfaces, defects, and impurities. Prerequisite(s): Placement in MATH 087 or ETEC 150 or concurrent enrollment.

Course Level Objectives

  1. Explain the differences in properties of different materials, including metals, alloys, ceramics, polymers, and composites.
  2. Relate the properties of materials to microstructure.
  3. Describe the basics of processing techniques for altering the microstructure and properties of different materials.
  4. Apply the basic principles of material selection to specific applications.

ETEC 177: Robotics 1

Credits: 5.0

Through the use of projects and hands-on exercises, students will learn to program a small scale robot to perform basic navigation under program control, with various sensor inputs, using feedback and control techniques. Prerequisite(s): ETEC 105 or ETEC 161 or concurrent enrollment or instructor permission.

Course Level Objectives

  1. Program a microcontroller.
  2. Describe the operation of a servo motor.
  3. Demonstrate the use of different types of basic sensors.
  4. Troubleshoot the software and hardware of a small robotic system.
  5. Program simple artificial intelligence into a robotic system.
  6. Write and execute a variety of programs for robotic navigation.
  7. Implement the use of a new microcontroller platform into an existing robot system.

ETEC 178: Robotics 2

Credits: 5.0

Through the use of functional testing and the oscilloscope, students will learn to troubleshoot a robotic system. Program and build a robot system using the Arduino prototyping platform. Prerequisite(s): ETEC 177.

Course Level Objectives

  1. Write complex programs that control a microcontroller based robot.
  2. Troubleshoot the hardware and software of a microcontroller system using functional testing and the oscilloscope.
  3. Program a microcontroller based control system using a compiler.
  4. Implement the use of a new platform using the old microcontroller robot system.
  5. Work as a team to accomplish a complex task with the microcontroller and robot.

ETEC 180: Polymer Technology

Credits: 5.0

Course provides an overview of thermoset and thermoplastic polymers. Topics include chemical composition, physical properties, deformation, mechanical behavior, fabrication, and processing and manufacturing of polymers. Prerequisite(s): Placement in MATH 087 or ETEC 150 or concurrent enrollment.

Course Level Objectives

  1. Describe the basic properties and characteristics of polymers.
  2. Explain and apply the basics of deformation, elasticity, and mechanical behavior in polymeric materials.
  3. Explain the relationship between polymer structure and properties.
  4. Identify the different types of polymers, including elastomers and fibers.
  5. Explain the various fabrication techniques of polymeric materials, and explain the advantages and disadvantages.
  6. Apply and explain the application of polymers to engineering and composite manufacturing.
  7. Perform basic qualification and selection of polymer materials.

ETEC 199: Special Projects in Engineering Technology

Credits: 1.0 to 5.0

For projects in Engineering Technology. Credit available with approval. For information contact the Department Head.

Course Level Objectives

  1. Produce a circuit, project, paper or presentation on a department approved topic.
  2. Research the topic on the Internet.
  3. Track their use of time in creating this project.

ETEC 200: Introduction to Composites

Credits: 5.0

General overview of composite materials and fabrication procedures. Covers composite constituents, material forms, mold design and development, ASTM standards, fabrication processes, composite applications, bonding, fastening, laminating, and finishing techniques. Prerequisite(s): Placement in MATH 087 or ETEC 150 or concurrent enrollment.

Course Level Objectives

  1. Explain the basic properties, characteristics, and constituents of composite materials.
  2. Explain the functions and elements of ASTM standards.
  3. Explain and apply the different fabrication processes for composite materials, including bonding, fastening, laminating, and finishing techniques.
  4. Describe the primary usage of composite materials in today's industry and potential for future applications.
  5. Perform basic fabrication processes in making composite structures.
  6. Follow procedures when using lab equipment, and apply safety procedures when working in the lab.

ETEC 205: Introduction to Automation Studio

Credits: 2.0

An introduction to Computer Aided Design and simulation software used for industrial pneumatic, hydraulic, mechanical and electrical automation systems.

Course Level Objectives

  1. Design a pneumatic, hydraulic, mechanical, or electrical (or combination) project.
  2. Identify components by their diagram symbol.
  3. Run and optimize a simulation

ETEC 215: Applied Statics

Credits: 5.0

Study of forces acting on structures at rest: free body diagrams (FBDs), trusses, friction and related material, which may include hydrostatic pressures and loads, cables and arches. Prerequisite(s): Placement in MATH 087 or ETEC 150 or concurrent enrollment.

Course Level Objectives

  1. Explain and apply the principles of vector mechanics, vector algebra, and of representation of physical quantities by a vector notation.
  2. Explain the physical meaning of a force and a moment equilibrium. Draw a correct and complete FBD of forces and moments for a structure.
  3. Explain and apply the method of joints and the method of sections for the analysis of trusses.
  4. Explain and apply the concept of friction on surfaces, calculate friction forces, and draw the proper FBD showing friction forces.
  5. Explain the difference between static and dynamic friction. Explain and apply the principles of internal forces in structures, and draw shear and moment diagrams for beams.

ETEC 220: Applied Strengths of Materials

Credits: 5.0

Study of forces acting on structures at rest; free body diagrams (FBDs), trusses and friction. Analysis of tension, compression, shear, deformation and stress acting on members. Prerequisite(s): ETEC 215 with at a grade of at least 2.0.

Course Level Objectives

  1. Explain and apply the principles of vector mechanics, vector algebra, and of representation of physical quantities by a vector notation.
  2. Explain the physical meaning of a force and a moment equilibrium.
  3. Draw a correct and complete FBD of forces and moments for a structure.
  4. Select and apply tools to analyze tension, compression, shear, deformation, torsion, and stress of members.
  5. Apply the basics of materials testing procedures to measure mechanical properties.
  6. Correctly use computerized materials test instrumentation and interpret test results.
  7. Run tensile, compressive, flexural, peel tests, and interpret test curves.

ETEC 230: Intermediate CAD and 3D Printing

Credits: 4.0

A continuation of SOLIDWORKS with an introduction to 3D printing that will be used in conjunction with CAD modeling. Prerequisite(s): ENGR& 114 or instructor permission.

Course Level Objectives

  1. Create advanced drawing configurations.
  2. Create assemblies that are ready for 3D printing.
  3. Print simple 3D parts.

ETEC 231: Advanced CAD and 3D Printing

Credits: 4.0

An advanced continuation of CAD using SOLIDWORKS with additional 3D printing applications and an introduction to CAM (Computer Aided Manufacturing). Prerequisite(s): ENGR& 114.

Course Level Objectives

  1. Create advanced assembly drawing configurations.
  2. Convert CAD drawings to CAM for CNC fabrication.
  3. Create and print advanced, moving 3D parts.

ETEC 250: Composites Engineering Design

Credits: 5.0

Overview of structural design utilizing composite materials including material and process selection, structural design, aesthetic qualities, assembly and practical design information. This is a lab based course focusing on product design. Prerequisite(s): ETEC 200 or concurrent enrollment.

Course Level Objectives

  1. Apply the basic principles of structural design utilizing composite material.
  2. Explain the advantages of planning a design to meet the manufacturing requirements.
  3. Apply the basic principles of material and process selection, structural design, aesthetic design, and assembly.
  4. Perform design, construction, and fabrication of laminated parts.
  5. Use appropriate terminology as it relates to composite structure design and manufacturing.
  6. Perform simple repairs of composite structures.
  7. Follow appropriate processes for structural and nonstructural evaluation, material handling, and surface preparation.

ETEC 251: Advanced Digital Circuits

Credits: 6.0

Advanced training in digital electronics. Covers analyzing, functional testing and systematic troubleshooting of digital circuits designed with logic gates, flip-flops, one shots, counters, dividers, decoders, shift registers, memory circuits, latches and buffers. Prerequisite(s): ETEC 163 or instructor permission.

Course Level Objectives

  1. Analyze and predict actual circuit operation of different types of digital circuits, using the thinking tools of basic electronics.
  2. Design functional tests for different types of digital circuits.
  3. Perform a functional test, interpret results, choose a circuit stimulus, and make systematic measurements, to isolate a fault.
  4. Document one's testing and troubleshooting process by recording information on a form and schematic.

ETEC 253: Advanced Linear Circuits

Credits: 6.0

Analyzing and systematic testing of linear circuits designed with operational amplifiers as comparators, buffers, amplifiers, filters, regulators, drivers, integrators and instrumentation amplifiers. D/A, A/D converters, timers and transistor circuits included. Prerequisite(s): ETEC 162 or instructor permission.

Course Level Objectives

  1. Analyze and predict actual circuit operation of different types of linear circuits, using the thinking tools of basic electronics.
  2. Design functional tests for different types of linear circuits.
  3. Using one's functional tests and hands-on circuit experience, be able to test, interpret tests, choose a circuit stimulus, and make systematic measurements, to isolate a fault.
  4. Document one's testing and troubleshooting process by recording information on a form and schematic.

ETEC 255: Special Topics: Engineering Technology

Credits: Maximum of 5.0 possible

Topics of current interest in Engineering Technology.

Course Level Objectives

  1. Demonstrate knowledge of a special topic in engineering technology.

ETEC 260: Composites Manufacturing

Credits: 5.0

Overview of processes involved in development and production of composite products. Includes tooling, fabrication, machining, assembly, quality assurance, repair, lay-up, vacuum bagging, and cureprocessing of wet laminating techniques and pre-impregnated materials. Prerequisite(s): ETEC 250 with a minimum grade of 2.0.

Course Level Objectives

  1. Apply the basic principles of structural design utilizing composite materials.
  2. Explain the advantages of planning a design to meet the manufacturing requirements.
  3. Apply the basic principles of materials and process selection, structural design, aesthetic design, and assembly.
  4. Perform design, construction, and fabrication of laminated parts.
  5. Use appropriate terminology as it relates to composite structure design and manufacturing.
  6. Perform simple repairs of composite structures.
  7. Follow appropriate processes for structural and nonstructural evaluation, material handling, and surface preparation.

ETEC 290: Engineering Technology Capstone Project

Credits: 5.0

Students use the skills developed during their prior courses to work as a team to design and build a project. Prerequisite(s): ETEC 200 (or concurrent enrollment) or ETEC 163.

Course Level Objectives

  1. Collaborate with other students and/or industry partners to define project parameters and project objectives.
  2. Prepare a written and oral presentation that describes the project.
  3. Demonstrate mastery of selected skills by completed project objectives.

ETEC 291: Engineering Technology Internship

Credits: 1.0 to 10.0

Students working toward the ETEC degree, who are in the second year of their coursework, receive on-the-job training in materials science. One credit for each 30 hours worked. Registration permitted first seven weeks (six in summer) as space is available. Prerequisite(s): Instructor permission.

Course Level Objectives

  1. Document their work hours at the internship site and produce a supervisor's evaluation of their work.
  2. Demonstrate skills necessary for the workplace at which the internship takes place.

ETEC 292: Career Planning and Workplace Relations

Credits: 2.0

Designed to give students an overview of engineering technology careers. Includes field trips, resume building, interviewing skills, job search skills and developing skills to work in groups. Prerequisite(s): Placement in ENGL& 101.

Course Level Objectives

  1. Search for information on specific careers.
  2. Obtain company information and assess best fit with personal professional interests and goals.
  3. Write and format an effective resume.
  4. Access local and regional resources to support job search.
  5. Apply interpersonal skills for effective teamwork, conflict resolution, motivation, leadership, and communication.

ETEC 299: Special Projects in Engineering Technology

Credits: 1.0 to 5.0

For individual projects in Engineering Technology. Note: Credit available with approval. For information contact the Department Head.

Course Level Objectives

  1. Produce a circuit, project, paper or presentation on a department approved topic of the student's choice.
  2. Research the topic on the Internet.
  3. Track their use of time in creating the project.